Authorize and control packing operations by starting/stopping packing when necessary and rejecting packaging materials or products that are out of specification.
Bring up, operate, maintain, and improve thermal and mechanical characterization workflows for advanced packaging materials, components, substrates, and assembled packages.
Package applications as Win32 (PSADT / IntuneWin) and deploy them through Intune. Convert legacy MSI, EXE and scripted installers, including from SCCM or other tools.
Lead package engineering development for Substrate-Based Power Modules, Flip-Chip, Multi-Chip Modules (MCM), and System-in-Package (SiP) architectures targeting AI acceleration and data center applications.
Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
Operate packaging system (bagging machine/granule packing machine/automatic weighing and filling machine), plant equipment and related processes as per Standard Operating Procedures (SOPs) and comply strictly to safety, quality and environmental guidelines.
Lead and support advanced semiconductor research on bio-based, biodegradable, recyclable, and sustainable materials for electronic packaging applications, including SSD, Flash, and emerging storage products.
Lead and support advanced semiconductor research on bio-based, biodegradable, recyclable, and sustainable materials for electronic packaging applications, including SSD, Flash, and emerging storage products.