Develop and debug ATE test programs for Digital, PMIC, RF, and Mixed-Signal semiconductor products using Advantest V93000 (SmartTest 7/8) and/or Teradyne UFLEX platforms.
Our client is a US-based pioneer and leading provider of ultra-low-power semiconductor solutions. We are seeking qualified candidate to join their Singapore team to work on breakthrough technologies powering the next wave of intelligent devices.
Develop advanced packaging technology platforms (fan-out packaging, 2.5D interposer and 3D stacking) capabilities and novel process integration approaches for heterogeneous chiplets integration.