Perform routine maintenance, calibration, and troubleshooting of electronic semiconductor manufacturing equipment to ensure optimal performance and minimize downtime.
Own and improve manufacturing process performance for Plasma Etching, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
Own and improve manufacturing process performance for Plasma Etching, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
Equipment Assembly: Perform mechanical and electrical assembly of semiconductor test systems, sub-assemblies, and wire harnesses using engineering drawings, schematics, and Bills of Materials (BOM).