STMicroelectronics in Muar, Malaysia is seeking a highly motivated DLC Engineer to support die location verification processes in semiconductor manufacturing. The successful candidate will ensure accurate die mapping, alignment, and defect localization.
The role involves operating inspection systems, performing monitoring, and collaborating with teams to resolve discrepancies. A bachelor's degree in a relevant engineering field and knowledge of semiconductor technology are required.
To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
To support assembly of engineering sample for new packages or new technologies.
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