Optimize production equipment layouts by applying industrial engineering principles to improve material flow, footprint efficiency, and overall factory output.
Perform scheduled preventive maintenance (PM) and unscheduled repairs on various semiconductor/fab equipment, focusing on MOCVD reactors, Lithography, E-Beam, Aligners, Coaters/ Developers, PECVD, RIE, Polishers, Metrology and other fab support tools.
Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
Full responsibility of equipment performance uptime. Define maintenance procedures and perform equipment maintenance to keep up and sustain machine basic condition.
Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies. Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics.
Perform scheduled preventive maintenance (PM) and unscheduled repairs on various semiconductor/fab equipment, focusing on MOCVD reactors, Lithography, E-Beam, Aligners, Coaters/ Developers, PECVD, RIE, Polishers, Metrology and other fab support tools.
Contributing to the design and development of hardware and software components for equipment in the semiconductor industry, including analysis, modeling, calculations, measurements, and qualification.
Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow (e.g., die attach, wire bond, active alignment, and general assembly), implementing continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.