Take technical ownership of the design, development, verification, and lifecycle maintenance of industrial PLCs, smart relays, I/O modules, and associated products.
Safely handle, inspect and clean delicate quartz and mechanical components using automated washing equipment in accordance with established Standard Operating Procedures (SOPs).
Process integration development for high density multi-chip fan-out wafer level packaging for various applications such as AI/ HPC, Co-package Optics, Power devices etc.