Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
Schedule, prioritize, & track your work across multiple projects simultaneously
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Responsible for product definition, design, test, and characterization of new isolation products.
Carry out R&D programs with cross-functional teams such as IC design engineering, test engineering, process engineering, product engineering, quality engineering, manufacturing team, and contract manufacturer to develop and perform product validation of new isolation products.
Initiate, plan and carry out engineering programs to achieve targets, breakthrough improvement in new product manufacturing yield, quality and reliability.
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