Kerja Sepenuh Masa MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer, Gaji tinggi SGD 7,000 di GLOBALFOUNDRIES SINGAPORE PTE. LTD. North Region (Singapore) - Maukerja

Introduction

The CMOS product team is seeking a Singapore-based Advanced Packaging 2.5D and Deep Trench Integration Engineer to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this engineer will support and drive integration activities for 2.5D solutions and deep trench (DT) technologies from early process development and test-vehicle execution through qualification and manufacturing readiness. The successful candidate will bring practical experience in semiconductor process integration, with expertise in deep trench structures and relevant 2.5D technologies such as silicon interposers, through-silicon vias (TSVs), redistribution layers, wafer thinning, bonding, and package-level integration. The role will coordinate module interfaces, execute experiments, analyze electrical and physical data, resolve integration issues, and support process control, reliability, yield, and manufacturability improvements. The candidate will work closely with engineering and manufacturing teams in Singapore and collaborate with GlobalFoundries’ global sites and ecosystem partners to deliver programme milestones and customer requirements.

Essential Responsibilities:

• Support and drive process integration for 2.5D and deep trench technology development programs, translating product and technology requirements into integration plans, experiments, and technical deliverables.

• Integrate deep trench process modules, including trench formation, dielectric and electrode materials, fill, planarization, thermal processing, isolation, contact formation, and electrical characterization.

• Support end-to-end integration of 2.5D solutions, including silicon interposers, TSVs, redistribution layers, wafer thinning and handling, bonding interfaces, assembly flows, and package integration.

• Plan and execute test structures, process splits, and structured DOEs to establish process windows, understand module interactions, and retire technical risks.

• Analyze inline, physical, electrical, defectivity, yield, and reliability data; identify trends and failure mechanisms; and recommend corrective actions.

• Partner with module, device, design, reliability, test, manufacturing, and equipment teams to resolve integration issues and improve process stability and manufacturability.

• Develop and maintain integration documentation, process-flow requirements, experiment plans, technical reports, risk assessments, and milestone status updates.

• Present technical findings, trade-offs, risks, and recommendations to project teams and management, and contribute to customer and partner technical discussions as needed.

• Build effective working relationships across the Singapore organization and GlobalFoundries’ worldwide technology development, manufacturing, reliability, test, and business teams.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programmes.

• This role is based in Singapore and requires regular on-site engagement with local technology development and manufacturing teams.

• Travel of up to 15% to other GlobalFoundries sites, suppliers, ecosystem partners, or customer locations may be required.

Required Qualifications:

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field from a recognized institution.

• Relevant experience in semiconductor process integration, device integration, advanced packaging, or technology development, including one of the following:

• B.S. with a minimum of 5 years of relevant experience

• M.S. with a minimum of 3 years of relevant experience

• Ph.D. with relevant research or industry experience

• Hands-on experience in deep trench integration and/or 2.5D technology development, with working knowledge of several of the following: deep trench etch, dielectric formation, electrode or trench fill, planarization, thermal processing, electrical characterization, silicon interposers, TSVs, redistribution layers, wafer thinning, bonding, assembly, or package qualification.

• Experience planning and executing experiments, analyzing technical data, troubleshooting process interactions, and supporting root-cause and corrective-action activities.

• Ability to work effectively across cross-functional engineering and manufacturing teams and manage assigned technical deliverables with limited supervision.

• Strong written and verbal communication skills in English, with the ability to work effectively across cultures and time zones.

• Currently based in Singapore or willing to relocate to Singapore and work on site.

Preferred Qualifications:

• Advanced degree in a relevant engineering or science discipline.

• Experience with deep trench capacitor, deep trench isolation, or related high-aspect-ratio silicon structures, including integration challenges associated with etch, fill, stress, leakage, capacitance, and reliability.

• Experience with 2.5D interposer or advanced packaging process flows and their electrical, thermal, mechanical, and manufacturability considerations.

• Experience in Singapore’s semiconductor ecosystem, including technology development or manufacturing within a wafer fab, foundry, OSAT, equipment or materials supplier, university, or research institute.

• Familiarity with semiconductor metrology, failure analysis, statistical data analysis, design of experiments, process control, qualification, and manufacturing hand-off.

• Ability to communicate complex technical findings clearly to engineering, management, customer, and partner audiences.