- Yishun North Region (Singapore) Singapore
Kerja Sepenuh Masa ATE Test Development Engineer, Gaji tinggi SGD 15,000 di AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED North Region (Singapore) - Maukerja
ATE Test Development Engineer
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Join Broadcom’s Global Operations team supporting the Core Switching Group as an ATE Test Development Engineer! In this high-impact role, you will shape the future of next-generation networking switches powering Scale-Up, Scale-Out, and Scale-Across architectures for AI and traditional cloud data centers. Based at our R&D innovation hubs in Irvine, CA or San Jose, CA, you will tackle groundbreaking engineering milestones, working hands-on with state-of-the-art Teradyne UltraFlex test platforms and cutting-edge silicon technology.
Responsibilities
Next-Gen Test Development:
Architect and bring up advanced ATE test programs for flagship networking switch ICs featuring high-speed SERDES ( >100G) and cutting-edge multi-die CoWoS advanced packaging.
Advanced Hardware Engineering:
Lead the hardware strategy for final test and wafer probe, partnering with top-tier PCB designers, socket vendors, and probe card suppliers to push performance limits.
Hands-On Silicon Debug:
Drive direct, hands-on debug on ATE, conquering complex electrical, mechanical, and extreme thermal challenges as chip power approaches unprecedented 10,000W thresholds.
Advanced Packaging & Thermal Innovation:
Solve novel mechanical and structural test challenges introduced by massive die sizes and multi-die CoWoS package integration.
Program Optimization & Yield Enhancement:
Optimize test flows and reduce test time to improve yield and manufacturing efficiency while ensuring uncompromising quality.
Cross-Functional Collaboration:
Partner closely with world-class Product, Design, and Packaging Engineers to bring complex silicon from concept to high-volume production.
Global Production Deployment:
Collaborate seamlessly with manufacturing teams across Asia to release and support robust production test programs.
Skills/Experiences
Hands-on experience with Teradyne UltraFlex tester platforms
Must be able to independently develop test programs, including complex test flows to support chip specifications around performance and power consumption
Must be able to support debugging/troubleshooting of various failure mechanisms with the part by working with cross-functional teams
Ability to perform volume data analysis, Correlate failures with system failures, Proficiency with Data analysis softwares/languages
Programming experience required for test method development
Ability to work with test hardware development teams, able to understand chip performance at ATE and contributions from the test hardware on chip behavior
Experienced with extreme temperature testing of ASICs at ATE
Experience with AI tools for quick script development is a plus
Preferred
Hands on experience with Prober, Handler, ATC
Skills working with AI tools/models
Usage of AI tools for test program development
Education:
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.
For more information, go to
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.
Responsibilities
Next-Gen Test Development:
Architect and bring up advanced ATE test programs for flagship networking switch ICs featuring high-speed SERDES ( >100G) and cutting-edge multi-die CoWoS advanced packaging.
Advanced Hardware Engineering:
Lead the hardware strategy for final test and wafer probe, partnering with top-tier PCB designers, socket vendors, and probe card suppliers to push performance limits.
Hands-On Silicon Debug:
Drive direct, hands-on debug on ATE, conquering complex electrical, mechanical, and extreme thermal challenges as chip power approaches unprecedented 10,000W thresholds.
Advanced Packaging & Thermal Innovation:
Solve novel mechanical and structural test challenges introduced by massive die sizes and multi-die CoWoS package integration.
Program Optimization & Yield Enhancement:
Optimize test flows and reduce test time to improve yield and manufacturing efficiency while ensuring uncompromising quality.
Cross-Functional Collaboration:
Partner closely with world-class Product, Design, and Packaging Engineers to bring complex silicon from concept to high-volume production.
Global Production Deployment:
Collaborate seamlessly with manufacturing teams across Asia to release and support robust production test programs.
Skills/Experiences
Hands-on experience with Teradyne UltraFlex tester platforms
Must be able to independently develop test programs, including complex test flows to support chip specifications around performance and power consumption
Must be able to support debugging/troubleshooting of various failure mechanisms with the part by working with cross-functional teams
Ability to perform volume data analysis, Correlate failures with system failures, Proficiency with Data analysis softwares/languages
Programming experience required for test method development
Ability to work with test hardware development teams, able to understand chip performance at ATE and contributions from the test hardware on chip behavior
Experienced with extreme temperature testing of ASICs at ATE
Experience with AI tools for quick script development is a plus
Preferred
Hands on experience with Prober, Handler, ATC
Skills working with AI tools/models
Usage of AI tools for test program development
Education:
- Bachelor's Degree and 8+ years of related experience, or Master's Degree and 6+ years of related experience
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.
For more information, go to
*************
.
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