Kerja Sepenuh Masa, Head of Test Engineering - Development di Carsem Perak - Maukerja

About the Role

Carsem, a member of Malaysian Pacific Industries and part of Hong Leong Manufacturing Group, is seeking an experienced, hands-on Head of Test Engineering & Development to lead our test engineering and product development organisation through a period of strong business growth and new customer program ramp.

Reporting to the General Manager, you will hold full leadership of the site’s test engineering function, driving test technology, product enablement, yield and customer technical support, while building and developing a high-performing engineering team.

This is a critical role for a technical leader who combines deep IC test expertise with the ability to scale teams, manage multiple customer programs and engage directly with global customers.

Key Responsibilities

• Lead the test engineering and development function, covering test engineering, product engineering and test technology development
• Drive new product introduction and test program release across multiple customer programs, ensuring fast and stable ramp to production
• Own ATE platform strategy, test equipment qualification and consigned equipment onboarding
• Improve test yield, throughput, cost of test and equipment utilisation across high-volume production
• Serve as the senior technical interface for global customers, leading technical reviews and resolving escalations
• Develop capabilities in advanced package and test technologies, including RF and mixed-signal devices
• Partner with Test Operations, Quality, Planning and Assembly to ensure stable, scalable operations
• Coach, mentor and develop engineering managers and their teams, building leadership capability and succession strength
• Own the engineering budget, including manpower, equipment and capital planning

Requirements

• 15 to 20 years of experience in semiconductor manufacturing, with a strong background in OSAT or backend test operations
• Minimum 8 to 10 years in a senior leadership or management role in test or product engineering
• Hands-on IC device and ATE test engineering experience; RF or mixed-signal exposure is an advantage (board or PCBA level test experience alone will not be considered)
• Proven track record managing large engineering teams and multiple customer programs
• Strong experience in advanced package and test technologies, with exposure to OSAT or IDM environments
• Demonstrated ability to support global customers on technical matters
• Excellent leadership, problem-solving and stakeholder management skills
• Degree in Electrical, Electronics or a related Engineering discipline

What We Offer

A high-impact leadership role at the heart of a major growth initiative, with the opportunity to shape and scale a world-class test engineering and development organisation.