- Yishun North Region (Singapore) Singapore
Kerja Sepenuh Masa Manufacturing Engineer, Gaji tinggi SGD 6,500 di STATS ChipPAC Pte. Ltd. North Region (Singapore) - Maukerja
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
About the role
To lead a team of Manufacturing Specialists in delivering quality output and on-time. To drive cycle time, cost, productivity, people & asset effectiveness.
Key responsibilities
Supervises, directs, plans, organizes and controls activities of staff on shifts of multiple functional areas
Presenting daily production indices in module meetings and highlighting key priorities for the Engineering Team
Analyzing WIP profile to minimize constraints in equipment, process, or manpower
Improve operational processes to enhance efficiency/ productivity to meet standard cycle time
Addressing issues that affect bottlenecks by working with various departments
Drive for continuous improvement in the line
Actively lead and participate in 6S
Recommend and implement measures to motivate employees and to encourage employees to recommend ways to improve process, quality, safety and efficiency
Maintains quality service by establishing and enforcing production standards
Conduct performance management, this includes discipline, discharge process and provide recognition/ promotion as needed based on result and behaviour
About you
1-3 years of relevant experience in semiconductor production
Min diploma qualification and above
Positive and can-do attitude as well as willingness to accept challenges
Demonstrate commitment to work and able to perform night shift duties
Good analytical skills and initiative
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
To lead a team of Manufacturing Specialists in delivering quality output and on-time. To drive cycle time, cost, productivity, people & asset effectiveness.
Key responsibilities
Supervises, directs, plans, organizes and controls activities of staff on shifts of multiple functional areas
Presenting daily production indices in module meetings and highlighting key priorities for the Engineering Team
Analyzing WIP profile to minimize constraints in equipment, process, or manpower
Improve operational processes to enhance efficiency/ productivity to meet standard cycle time
Addressing issues that affect bottlenecks by working with various departments
Drive for continuous improvement in the line
Actively lead and participate in 6S
Recommend and implement measures to motivate employees and to encourage employees to recommend ways to improve process, quality, safety and efficiency
Maintains quality service by establishing and enforcing production standards
Conduct performance management, this includes discipline, discharge process and provide recognition/ promotion as needed based on result and behaviour
About you
1-3 years of relevant experience in semiconductor production
Min diploma qualification and above
Positive and can-do attitude as well as willingness to accept challenges
Demonstrate commitment to work and able to perform night shift duties
Good analytical skills and initiative
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
Peringatan Penting
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