jobs in Randstad Malaysia

Kerja Sepenuh Masa, NPI Engineer (Semiconductor) di Randstad Malaysia Melaka - Maukerja

Kampung Ladang, Melaka

Kongsi
Simpan

Lokasi Kerja

  • Kampung Ladang Melaka Malaysia

Penerangan Kerja

Tanggungjawab

About The Company

Our client is an established semiconductor manufacturing company specialising in advanced IC packaging and assembly solutions. They are currently seeking experienced NPI Engineers to support new product development, manufacturing readiness and successful product introduction within their power semiconductor business.

This opportunity is ideal for engineers with strong technical knowledge in semiconductor packaging, hands-on NPI experience and the ability to collaborate with internal stakeholders and external customers.

About The Job

  • Lead and coordinate New Product Introduction (NPI) activities for power semiconductor products, from initial development through manufacturing introduction.
  • Evaluate packaging designs and manufacturing process feasibility to ensure product quality, reliability and production readiness.
  • Act as the key technical liaison between customers and internal engineering, manufacturing and commercial teams.
  • Provide technical support and resolve engineering challenges throughout product development and introduction.
  • Conduct product costing evaluations, BOM reviews and manufacturing process assessments to identify cost optimisation opportunities.
  • Drive continuous improvement and systematic cost reduction initiatives across product and manufacturing processes.
  • Collaborate with cross-functional teams to ensure successful product qualification, introduction and transition into production.

About The Qualifications

  • Diploma or Bachelor's Degree in Mechanical Engineering, Electrical & Electronic Engineering, Materials Science or a related technical discipline.
  • Minimum 2 years of relevant engineering experience within the semiconductor industry.
  • Proven experience in NPI, preferably involving power semiconductor products and IC packaging processes.
  • Good understanding of semiconductor assembly processes, packaging design and manufacturing feasibility.
  • Experience supporting major semiconductor customers or working on customer-driven NPI projects would be an added advantage.
  • Familiarity with BOM management, product costing and cost reduction initiatives.
  • Strong technical problem-solving, stakeholder management and cross-functional communication skills.
  • Good command of English, with the ability to communicate effectively with international stakeholders.

Peringatan Penting

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