- Simpang Ampat Pulau Pinang Malaysia
Kerja Sepenuh Masa, Senior Engineer, Packaging Engineering di Sandisk Pulau Pinang - Maukerja
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.
Lead and integrate assembly/test data pipeline, analyze and transform process data.
In-depth fundamental investigation/characterization in packaging development.
Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards.
To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products.
To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities.
Lead yield integration and detailed analysis activities in wafer level processing characterization and qualification phases.
Qualifications
REQUIRED:
Bachelor’s or Master’s degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline. Minimum 5 years of Semiconductor Packaging Process with in-depth knowledge on Fab, SMT, IC packaging processes, high-density 2.5D/3D advanced packaging architecture or wafer level packaging will be desired.
Preferred
Track record of AI/ML experience is added advantage.
Demonstrated track record to rapidfailurely analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
Strong attention to detail and commitment to achieving goals.
Ability to adapt to changing priorities and work efficiently in a fast-paced environment.
Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology & wafer level packaging solutions.
Skills
Proficiency in statistical data analysis using JMP software.
Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology, especially on inspection or metrology tools.
Strong analytic skills and problem-solving skills.
Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing.
Strong communication and teamwork skills.
Self-motivated, organized, and able to manage multiple tasks in a dynamic environment.
Additional Information
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ************* to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.
Lead and integrate assembly/test data pipeline, analyze and transform process data.
In-depth fundamental investigation/characterization in packaging development.
Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards.
To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products.
To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities.
Lead yield integration and detailed analysis activities in wafer level processing characterization and qualification phases.
Qualifications
REQUIRED:
Bachelor’s or Master’s degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline. Minimum 5 years of Semiconductor Packaging Process with in-depth knowledge on Fab, SMT, IC packaging processes, high-density 2.5D/3D advanced packaging architecture or wafer level packaging will be desired.
Preferred
Track record of AI/ML experience is added advantage.
Demonstrated track record to rapidfailurely analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
Strong attention to detail and commitment to achieving goals.
Ability to adapt to changing priorities and work efficiently in a fast-paced environment.
Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology & wafer level packaging solutions.
Skills
Proficiency in statistical data analysis using JMP software.
Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology, especially on inspection or metrology tools.
Strong analytic skills and problem-solving skills.
Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing.
Strong communication and teamwork skills.
Self-motivated, organized, and able to manage multiple tasks in a dynamic environment.
Additional Information
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ************* to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
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