- Yishun North Region (Singapore) Singapore
Kerja Sepenuh Masa Senior Associate Process Engineer - Package pick - place process, Gaji tinggi SGD 4,000 di STATS ChipPAC Pte. Ltd. North Region (Singapore) - Maukerja
Senior Associate Process Engineer - Package pick - place process
STATS ChipPAC Pte. Ltd.
Kongsi
Simpan
Lokasi Kerja
Penerangan Kerja
Tanggungjawab
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
To provide technical and administrative support to Process Engineers in eWLB Backend2 Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.
Key responsibilities
Perform production line sustaining to ensure all the processes are running without any quality issue
Follow up the process improvement projects which assigned by Process Engineer
Characterize new devices and create recipes in the machine.
Immediate response to investigate and analyze products with problem
Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
Cross support with other Associate Engineer to clear equipment downtime
Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists or Manufacturing Specialists
What we're looking for
Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent
2 years of relevant experience in Die Pick & Place, Package Pick & Place or Tape & Reel are preferred
Positive mindset with ability to adapt to fast-paced working environment
Ability to work on 12 hours rotating shift
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
To provide technical and administrative support to Process Engineers in eWLB Backend2 Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.
Key responsibilities
Perform production line sustaining to ensure all the processes are running without any quality issue
Follow up the process improvement projects which assigned by Process Engineer
Characterize new devices and create recipes in the machine.
Immediate response to investigate and analyze products with problem
Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
Cross support with other Associate Engineer to clear equipment downtime
Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists or Manufacturing Specialists
What we're looking for
Diploma or Degree in Electric & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent
2 years of relevant experience in Die Pick & Place, Package Pick & Place or Tape & Reel are preferred
Positive mindset with ability to adapt to fast-paced working environment
Ability to work on 12 hours rotating shift
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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