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Kerja Sepenuh Masa, Senior Research Engineer, Process Modules di A*STAR - Agency For Science, Technology And Research - Maukerja

Senior Research Engineer, Process Modules

A*STAR - Agency For Science, Technology And Research

Sepenuh Masa

Singapore

Kongsi
Simpan

Lokasi Kerja

  • Singapore

Penerangan Kerja

Tanggungjawab

We are seeking a Lead Research Engineer to drive the development of advanced wafer pre-assembly processes, including backgrinding, wafer thinning, edge trim, dicing, and singulation technologies for next-generation semiconductor and advanced packaging applications.

Key Responsibilities

Technical Leadership & Project Management

  • Lead and mentor a team of engineers in developing advanced wafer pre-assembly technologies.
  • Define technical roadmaps and align process development with industry and customer requirements.
  • Initiate, plan, and execute R&D projects, including collaborations with equipment and material suppliers.
  • Drive process transfer from development to pilot manufacturing environments.

Process Development

  • Develop and optimize wafer backgrinding, stress relief, edge trim, dicing, and singulation processes.
  • Evaluate and qualify new grinding wheels, dicing blades, laser dicing technologies, tapes, and consumables.
  • Optimize process performance for wafer thickness control, TTV, edge quality, chipping, wafer warpage, and yield.
  • Address integration challenges associated with ultra-thin wafers, compound semiconductors, MEMS, photonics, and advanced packaging applications.

Characterization & Failure Analysis

  • Conduct process characterization and performance evaluation using metrology and inspection tools.
  • Investigate wafer breakage, micro-cracks, edge chipping, particle generation, and singulation-related defects.
  • Analyze process and yield data to identify root causes and implement corrective actions.
  • Work closely with integration, reliability, and manufacturing teams to resolve process issues.

Innovation & Collaboration

  • Generate technical reports, patents, publications, and intellectual property.
  • Collaborate with equipment vendors, material suppliers, and research partners to develop next-generation solutions.
  • Support business development activities by engaging customers and translating industry challenges into R&D programs.
  • Mentor junior engineers and contribute to building organizational capabilities.

Qualifications

  • Bachelor's Degree or Master Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Physics, or a related discipline.
  • Minimum 8-10 years of experience in semiconductor process development.
  • Hands-on experience in backgrinding, wafer thinning, stress relief, edge trim, dicing, and singulation processes.
  • Strong understanding of wafer handling, defect control, process integration, and advanced packaging technologies.
  • Experience with failure analysis, DOE, statistical process control, and semiconductor metrology.
  • Proven track record in leading technical projects and working with cross-functional teams.

Peringatan Penting

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