Our client is a leading global semiconductor manufacturing company specializing in advanced semiconductor technologies. They are expanding their operations and are looking for motivated individuals to join their growing team.
Position:
Associate Engineer – Wire Bond Equipment
Location:
North Region
Working Hours:
12-hour rotating shift (Day & Night Shift)
Employment Type:
Permanent Role
Job Responsibilities
Perform equipment setup, qualification, and conversion for Wire Bond machines.
Troubleshoot and repair equipment-related issues to minimize production downtime.
Conduct preventive and corrective maintenance to ensure equipment reliability.
Monitor equipment performance and implement improvement actions.
Support production during machine breakdowns and urgent technical issues.
Perform root cause analysis, implement corrective actions, and maintain equipment and spare parts records.
Job Requirements
Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering, or related discipline.
Minimum
2 years of hands-on experience
in
Wire Bond equipment maintenance and troubleshooting.
Experience with
KNS Maxum, iConn, or Rapid Bonder machines is preferred.
Strong equipment troubleshooting, maintenance, and problem-solving skills.
Knowledge of semiconductor backend assembly processes is an advantage.
Willing to work
12-hour rotating shifts, including day and night shifts
.
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