Kerja Sepenuh Masa, Lead-Silicon Photonics Engineer(Foundry Tape-Out)x2 di Randstad Singapore - Maukerja

• Lead,mentor,and grow a small,agile team of engineers dedicated to Silicon Photonics PIC development,fostering a culture of high-ownership and rapid iteration.
• Drive the design,optimization,and integration of passive and active PIC building blocks,including waveguides,modulators,detectors,couplers,and heaters.
• Manage the end-to-end tape-out process on foundry PDKs for MPW and production runs.
• Oversee layout hierarchy,verification flows,DRC/LVS checks,fill/density rules,and GDS/mask readiness.
• Execute photonic,thermal,and tolerance simulations.
• Translate results into robust design rules,performance margins,and practical engineering tradeoffs.
• Define test structures,measurement plans,and acceptance criteria.
• Analyze electro-optic data from first-silicon to drive model updates,yield improvements,and manufacturability.
  
  

• Master's or ************* Electrical Engineering,Physics, Photonics,Optics,or a closely related field
• 5+ years of hands-on industry experience in integrated silicon photonics PIC design (both active and passive devices).
• Demonstrated track record of taking designs through tape-out to silicon.
• Must be highly capable of producing DRC-clean layouts and executing disciplined verification procedures.
• Hands-on expertise with industry-standard simulation software (Lumerical,RSoft,or COMSOL) and layout platforms (KLayout,Cadence,or IPKISS).
• Direct experience with high-speed micro-ring or Mach-Zehnder modulators (MRM/MZM),dense Wavelength-Division Multiplexing (WDM) architectures, and Co-Packaged Optics (CPO).
• Familiarity with heterogeneous integration (e.g.,III-V/Si hybrid lasers) and an understanding of packaging,thermal design, and reliability for transceiver-class PICs.

If you are interested in the position, kindly apply to this job or send your CVs to *************(@)*************

We regret that only shortlisted candidates will be contacted

EA: 94C3609 / R1325913