jobs in APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.

Kerja Sepenuh Masa Manager, Process Engineer, Gaji tinggi SGD 10,000 di APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. East Region (Singapore) - Maukerja

Manager, Process Engineer

APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.

East Region (Singapore)

Kongsi
Simpan

Lokasi Kerja

  • 8 UPPER CHANGI ROAD NORTH East Region (Singapore) Singapore

Penerangan Kerja

Tanggungjawab

Key Responsibilities

  • Lead the development and scaling of next-generation advanced packaging technologies, leveraging expertise in thin film deposition processes including Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), and/or Atomic Layer Deposition (ALD) to enable customer roadmaps and address critical technology challenges.

  • Drive process and technology roadmap development for advanced packaging, 3D integration, and related semiconductor applications through collaboration with customers, research organizations, and cross-functional engineering teams.

  • Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on extremely complex systems for entire range of products for division

  • Interact with key customers to resolve extremely complex process engineering issues to address customers High Value Problems (HVP) for an entire range of products for the division

  • Ensures effective product/technology demonstrations

  • Leads collaboration efforts with executive managers and junior managers to ensure strategic execution

  • Leads market share improvement efforts

Functional Knowledge

  • Demonstrates comprehensive understanding of concepts and principles within own job family and knowledge of other related job families

  • Possesses deep technical expertise in semiconductor thin-film deposition technologies, including PVD, CVD, and/or ALD, and a strong understanding of materials engineering, process integration, and advanced packaging applications.

  • Demonstrates knowledge of advanced packaging technologies, TSV, hybrid bonding, wafer-level packaging, and related semiconductor manufacturing processes.

  • Demonstrated experiences in supervisory or management capacity.

  • Outstanding communication and interpersonal skills with the ability to influence internally and externally, including senior management

  • Problem-solver attitude with determination and quality-mindset management

Work Location

  • Science Park II (Moving to Tampines from Apr 2027)

Peringatan Penting

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