Jawatan Kosong Mechanical Engineering di Bayan Lepas - September 2026

search.result_querys_job "mechanical engineering" text.in Bayan Lepas
Jangan lepaskan peluang untuk kerja Mechanical Engineering terkini! di Bayan Lepas
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...

Jadilah pemohon terawal!

Posted
16 days ago
Peluang tinggi
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...

Jadilah pemohon terawal!

Posted
16 days ago
Peluang tinggi
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
MYR6,000 - MYR8,000 Sebulan
  • Equipped with critical and systemic thinking – ability to identify and drive effective but simple quality improvement plan and solutions.
  • Bachelor Degree in engineering, preferably in material, chemical or mechanical engineering
  • At least 5 years of leadership roles in Quality Management System (QMS), preferably with actual product/process/customer quality management experience. ...
Posted
a month ago
Boleh Sembang
Up to MYR6,500 Sebulan
  • Established customer network and proven sales track record.
  • Strong communication, negotiation, and presentation skills.
  • Target-driven with strong business development mindset. ...
Communication Negotiation
+5

Jadilah pemohon terawal!

Posted
a month ago
Boleh Sembang
Undisclosed
  • Practical experiences with all the equipment’s in die attach process.
  • Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
11 days ago
Boleh Sembang
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
16 days ago
Peluang tinggi
Boleh Sembang
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering
  • Additional Desirable Qualifications:
  • Practical experiences with all the equipment’s in die attach process. ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
Undisclosed
  • Practical experiences with all the equipment’s in die attach process.
  • Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
19 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...

Jadilah pemohon terawal!

Posted
16 days ago
Boleh Sembang
MYR5,000 - MYR7,000 Sebulan
Sales Engineering Problem-Solving
+1
Posted
8 days ago
Boleh Sembang
MYR6,000 - MYR7,500 Sebulan
  • Keupayaan untuk bekerja secara bebas dan berdisiplin dalam menguruskan projek.
  • Pengurusan projek dan kemahiran analitis yang baik.
  • 5+ tahun dalam peralatan semikonduktor bahagian hadapan sebagai Jurutera Peralatan Fab, Jurutera Khidmat Pelanggan, atau Jurutera Sokongan Teknikal (syarikat Tahap 1 diutamakan). ...
Good electro-mechanical equipment troubleshooting skills. Read and orally communicate in Mandarin (writing ability not required).
+3

Jadilah pemohon terawal!

Posted
9 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Job Overview: ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...
Posted
16 days ago
Boleh Sembang
Undisclosed
  • Experience in Die Attach Process.
  • Have equipment or process programming knowledge background.
  • Basic communication skills and good learning and feedback ability. ...
Posted
16 days ago