Minimum certificate in Mechanical Engineering/Manufacturing or 0-6 years hands-on experience.
Minimum 2–6 years working experience in assembly quality inspection.
Able to read basic engineering drawings. Competent in using measuring tools (caliper, multimeter, torque tools). Able to perform inspection independently.
Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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