Perform and manage IC failure analysis activities, including electrical verification, fault isolation, physical defect localization, and root cause analysis.
Perform and manage IC failure analysis activities, including electrical verification, fault isolation, physical defect localization, and root cause analysis.
First Article Inspection (FAI): Lead and perform FAI for machined inserts, cores, cavities, electrodes, and tooling components, verifying critical dimensions, GD&T, and surface finish with tight tolerances up to $\pm 0.002\text{ mm}$.