Review and abide by all Company policies in the latest revision of the Employee Handbook.
Shall comply with all terms and conditions of any applicable employment agreement.
Support CM (Contract Manufacturer) to operate SMT/DIP equipment, troubleshoot PCBA production issues and implement corrective actions promptly, minimize downtime, optimize production parameters, and ensure continuous production improvement.
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Participate in the repair of production defective PCBA boards, following established procedures and guidance.
Response for failure analysis activities and repair machine (ex. BGA machine, tooling…etc) for defective boards. Collaborate with R&D on critical non-conformance (NG) symptoms were required.
Response for preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
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Lead the manufacturing lifecycle of semiconductor equipment from order kick-off, RFQ, procurement, assembly, testing and final customer buy-off.
Coordinate with Engineering, Production, Procurement, Quality and suppliers to ensure project milestones, quality requirements and delivery schedules are achieved.
Manage BOM accuracy, ECN implementation, engineering drawings and manufacturing documentation to support efficient production.
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Lead the manufacturing lifecycle of semiconductor equipment from order kick-off, RFQ, procurement, assembly, testing and final customer buy-off.
Coordinate with Engineering, Production, Procurement, Quality and suppliers to ensure project milestones, quality requirements and delivery schedules are achieved.
Manage BOM accuracy, ECN implementation, engineering drawings and manufacturing documentation to support efficient production.
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Support and participate in the repair of production defective PCBA boards, following established procedures and guidance.
Assist with NPI build activities, including basic debugging, analysis, and repair of defective boards, as part of cross-functional support.
Work closely with the product engineering team to help identify and resolve production-related issues, including those arising from SMT and PCBA assembly processes.
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Participate in the repair of production defective PCBA boards, following established procedures and guidance.
Response for failure analysis activities and repair machine (ex. BGA machine, tooling…etc) for defective boards. Collaborate with R&D on critical non-conformance (NG) symptoms were required.
Response for preparing failure analysis reports, repair records, and related documentation, contributing to traceability and continuous improvement efforts.
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Partner with the NPI team on new product introduction projects, working closely with R&D, Quality, Manufacturing, Procurement, Sourcing, and Operations to ensure a smooth transition from design to stable mass production, aligned with program timelines and quality objectives.
Support the design of 3D CAD models and 2D drawings for components involving mechanisms, sheet metal structures, plastic housings, and gearing systems.
Conduct Design for Manufacturing and Assembly (DFMA), Design for Inspection (DFI), and Design to Cost (DTC) reviews to ensure designs are manufacturable, inspectable, and cost-effective.
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Establish and maintain QMS (ISO13485/ISO9001), conduct internal, customer and regulatory audits, manage full processes of deviation, change, CAPA and non-conforming products.
Manage full-range quality inspection for incoming materials, in-process and finished goods, analyze quality issues via 8D/RCA, and close customer complaint corrective actions.
Coordinate IQ/OQ/PQ validation of equipment and processes, compile inspection standards, SOPs and other system documents.
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Bachelor's Degree in Industrial Engineering, Manufacturing Engineering, Mechanical Engineering or equivalent.
Minimum 5 years of relevant experience in industrial engineering, project management, or manufacturing engineering within the electronics, semiconductor or equipment manufacturing industry.
Strong knowledge of manufacturing processes, production planning, plant layout, assembly operations, BOM management and engineering change control (ECN).
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