Perform measurement on characterization / evaluations samples following the experiment plan prepared by Engineer. As well as production monitoring samples.
Perform cleanroom environmental surveys and area buy-offs, including Filter Fan Unit surface velocity and leak scan, airborne particle counts and surface contamination sampling.
Candidates should possess skills in Facilities Engineering and Facility Management (FM) to plan, design, and oversee building systems, utilities, and infrastructure in a semiconductor manufacturing environment.
Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
Execute reliability testing and qualification activities for semiconductor modules and component-level products in accordance with approved test plans.