Jawatan Kosong Electronics Engineering di Bayan Lepas - October 2026
Paparan 72 hasil carian kerja kosong untuk
"electronics engineering"
di Bayan Lepas
MYR2,500 - MYR3,300 Sebulan
- Hands-on experience in electrical and electronic measurement activities
- Ability to perform testing independently with minimal supervision
- Familiarity with electronic measurement equipment (e.g., oscilloscope, power supply, electronic load) ...
Posted
2 months ago
MYR2,100 - MYR4,000 Sebulan
Graduan Baru
- Good working attitude, good attendance & punctuality and willing to learn and have good Quality conscious.
- Basic oral communication abilities.
- Able to read and write in the English language. ...
Posted
18 days ago
MYR2,200 - MYR2,500 Sebulan
+Pampasan Tambahan
Graduan Baru
- Technician or Freshie from Diploma / Degree Electrical or Electronic or Mechatronic
- Excellent working knowledge of semiconductor manufacturing equipment, especially RF Matching Networks and Generators
- Able to work on shift
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Qualification & Experience:
- Experienced in AOI process and able to perform troubleshooting, set-up, conversion and recipe creation.
- Employment Type : Full time ...
Posted
a month ago
Lead Process Design Engineer
MYR8,000 - MYR15,000 Sebulan
- Semiconductor and/or Pharmaceutic project reference is preferred;
- Strong ability in process problem diagnosis and solution, able to independently lead process optimization and fault handling of complex systems;
- English working capability is mandatory and Bahasa Malaysia Mandarin is preferred; ...
Jadilah pemohon terawal!
Posted
a day ago
Senior Process Design Engineer
MYR8,000 - MYR15,000 Sebulan
- Semiconductor and/or Pharmaceutic project reference is preferred;
- Strong ability in process problem diagnosis and solution, able to independently lead process optimization and fault handling of complex systems;
- English working capability is mandatory and Bahasa Malaysia Mandarin is preferred; ...
Jadilah pemohon terawal!
Posted
a day ago
MYR4,500 - MYR6,000 Sebulan
- Demonstrates strong leadership and team management skills with the ability to coach, motivate, and discipline production staff Ability to work in fast-paced environment
- Familiarity with ISO standards, ESD procedures, and safety regulations in a manufacturing setting.
- Min. Diploma or equivalent education level in Manufacturing, Engineering, Business or any related field ...
Posted
11 days ago
Undisclosed
- Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
- Employment Type : Full time
- Fluent in English, and Bahasa Malaysia.
Posted
a month ago
MYR3,800 - MYR5,000 Sebulan
- Capable of process improvement, yield analysis, and defect troubleshooting.
- Responsible, self-motivated, and able to work independently or in a team.
Posted
2 months ago
MYR8,000 - MYR15,000 Sebulan
- Semiconductor and/or Pharmaceutic project reference is preferred;
- Strong ability in process problem diagnosis and solution, able to independently lead process optimization and fault handling of complex systems;
- English working capability is mandatory and Bahasa Malaysia Mandarin is preferred; ...
Jadilah pemohon terawal!
Posted
3 days ago
Undisclosed
- To support wire bond process engineering works and carry out yield, quality, cost savings, productivity improvements and documentation.
- Qualification & Experience:
- Degree in related discipline with min 5 years relevant working experience or graduate with the degree in any Electronics, Electrical, Mechanical or Mechatronics engineering course.
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Design new leadframe packages and handle project management.
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Diploma in Electrical/Electronics/Mechanical Engineering.
- Basic knowledge in Molding process (Hydraulic and servo system,)
- Able to read schematic diagram. ...
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Good knowledge of FMEA, DOE, SPEC and risk analysis.
- Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.
- Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering. ...
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Additional Desirable Qualifications: Fresh Grad/Min 1 years relevant working experience in semiconductor / Electronics manufacturing environment.
- Job Overview:
- Responsible for supporting encap production line include Pre-Encap Plasma – Encap cure process. Responsible for any product yield and machine downtime related issue with regards to equipment, maintenance, product and process.
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Minimum qualification is a Diploma in Electronics/Microelectronics.
- The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
- Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc. ...
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Practical experiences with all the equipment’s in die attach process.
- Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Jadilah pemohon terawal!
Posted
a month ago
Undisclosed
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering
- Additional Desirable Qualifications:
- Practical experiences with all the equipment’s in die attach process. ...
Posted
a month ago
Undisclosed
- Qualification & Experience:
- Experienced in AOI process and able to perform troubleshooting, set-up, conversion and recipe creation.
- Employment Type : Full time ...
Posted
a month ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
a month ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
a month ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
a month ago
Undisclosed
- Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
- Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
- Job Overview: ...
Posted
a month ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Posted
a month ago
Undisclosed
- Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.
- Degree in Mechanical/ Electronics / Electrical /Mechanical /Robotics and Artificial Intelligence Engineering
- Min 2 years in semiconductor industry in the field of assembly engineering. ...
Posted
a month ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Posted
a month ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Posted
a month ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Posted
a month ago
Undisclosed
- Experience in Die Attach Process.
- Have equipment or process programming knowledge background.
- Basic communication skills and good learning and feedback ability. ...
Posted
a month ago