• Minimum 2 years of experience working in Molding and De-bonding process.
• Knowledge in basic SPC and Microsoft Office
• Flexible to work under various shift pattern. The selected candidate will start with office hours first, and eventually work on 12-hour rotating shift (day and night)
• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations.
• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection).
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