Develop detailed thermal models (steady state and transient) for flip chip packages using tools such as Celsius, Flotherm, COMSOL, or Icepak to evaluate heat dissipation, junction temperature, and thermal cycling performance.
Dynamic warpage modeling: Develop and validate models of die, substrate and package deformation throughout assembly and customer SMT reflow. Assess temperature-dependent behaviour to identify warpage risks that may not be apparent at room temperature, and recommend improvements to protect assembly yield and solder-joint integrity.