- Develop new customers and expand business in Johor & Melaka region
30+ days
45 Semiconductor Packaging Jobs in Malaysia | Job Vacancies | November 2026 | Maukerja
Showing 45 jobs results for
"semiconductor packaging"
- Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
30+ days
- Perform process improvement plan and sustaining activity to ensure process yield improve.
30+ days
- Design new package types and conduct feasibility study / Technical Gap Analysis.
30+ days
- Equipment Operation and Monitoring:
30+ days
- Equipment Operation and Monitoring:
30+ days
- Develop new customers and expand business in Johor & Melaka region
30+ days
- Develop new customers and expand business in Johor & Melaka region
30+ days
- Develop new customers and expand business in Johor & Melaka region
30+ days
- Develop new customers and expand business in Johor & Melaka region
30+ days
Head of Advanced Semiconductor Packaging Design - Simulation
- Define advanced packaging architectures, technology roadmaps and design strategies to support current and future semiconductor products.
6 days
Quality Engineer – Semiconductor Packaging
- Work with Packing Material (Tray, Carrier tape) suppliers to design or select suitable carrier for IC products.
19 days
- Oversee technology and industry insights from legacy package to advanced packaging market trends from devices to package type.
28 days
Packaging Operator (Manufacturing - Semiconductor) - No Prior experience needed
6 days
[0580] Application - Process Engineer – Semiconductor Die Bonding -- Advanced Packaging | Up to $6k - 5 days - Woodlands
- Working Location: Woodlands North Coast
8 days
[0580] Process Engineer – Semiconductor Die Bonding -- Application -- Advanced Packaging | Up to $6k - 5 days - Woodlands
- Working Location: Woodlands North Coast
19 days
Semiconductor Assembly Technician | North-East - TCJ
1 day
Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
8 days
Staff-Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
- Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
8 days
Staff-Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
8 days
Senior Packaging Development Engineer - Substrate Modules
- Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
8 days
Die Bond Technician - Operator
9 days
- Lead business development efforts in Singapore and across international markets, with a focus on Cloud Service Providers (CSPs), OEMs/ODMs, and the electronics sector.
13 days
Advanced Packaging Principle Integration Technologist (Principal Engineer, 10 years- experience) 1
- Work Your Magic with us!
13 days
Global OSAT Operation Engineering
- Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites.
13 days
Senior Research Engineer II, fan-in-fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME
- Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies, including Fan-In/Fan-Out Wafer Level Packaging (FOWLP), 2.5D interposers, and W2W/C2W 3D integration.
15 days
Senior Packaging Development Engineer - Substrate Modules
- Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
16 days
- Perform technical tests and experiments for engineering in the wafer fabrication area of semiconductor manufacturers
8 days
- Equipment Lifecycle Management: Lead the evaluation, selection, procurement, set-up, and qualification of new manufacturing equipment and the necessary facility infrastructures.
13 days
Packaging development engineer
- Take ownership of FC-FE die attach and underfill processes for semiconductor packages, including advanced package platforms.
22 days