Technician, Packing (Flour)JBFM Flour Mill Sdn BhdMYR1,700 - MYR2,300 SebulanSepenuh MasaPerai, Pulau PinangCommunication skill30+ hariSimpanMohonLihat Kerja Serupa
Encap EngineerASE Electronics (M) Sdn. Bhd.UndisclosedSepenuh MasaBayan Lepas, Pulau PinangAdditional Desirable Qualifications: Fresh Grad/Min 1 years relevant working experience in semiconductor / Electronics manufacturing environment.30+ hariSimpanMohonLihat Kerja Serupa
Package Saw TechnicianASE Electronics (M) Sdn. Bhd.UndisclosedSepenuh MasaBayan Lepas, Pulau PinangJob Overview:30+ hariSimpanMohonLihat Kerja Serupa
Design Engineer (Leadframe)ASE Electronics (M) Sdn. Bhd.UndisclosedSepenuh MasaBayan Lepas, Pulau PinangDesign new leadframe packages and handle project management.30+ hariSimpanMohonLihat Kerja Serupa
Junior Die Attach TechnicianASE Electronics (M) Sdn. Bhd.UndisclosedSepenuh MasaBayan Lepas, Pulau PinangDegree in Electronics / Electrical /Chemical/Mechanical Engineering30+ hariSimpanMohonLihat Kerja Serupa
Wire Bond Process & Equipment Engineer (KNS)ASE Electronics (M) Sdn. Bhd.UndisclosedSepenuh MasaBayan Lepas, Pulau PinangCandidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.30+ hariSimpanMohonLihat Kerja Serupa
Associate Die Attach TechnicianASE Electronics (M) Sdn. Bhd.UndisclosedSepenuh MasaBayan Lepas, Pulau PinangDegree in Electronics / Electrical /Chemical/Mechanical Engineering30+ hariSimpanMohonLihat Kerja Serupa
Packaging EngineerASE Electronics (M) Sdn Bhd.MYR3,200 - MYR7,000 SebulanLihat GajiSepenuh MasaBayan Lepas3 hariSimpanMohon
Packaging Engineer (Process Module Development)SandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat1 hariSimpanMohon
Packaging Engineer (Die Attach)SandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat17 hariSimpanMohon
Packaging Engineer (Process Module Development)SandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat23 hariSimpanMohon
Engineer, Packaging EngineeringSandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat15 hariSimpanMohon
Advanced Packaging Engineer (Bumping)TF-AMD PenangUndisclosedLihat GajiSepenuh MasaBayan Lepas28 hariSimpanMohon
Senior Engineer, Packaging EngineeringSandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat11 hariSimpanMohon
PHD FRESH GRAD - Senior Packaging Engineer, Material EngineeringSandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat17 hariSimpanMohon
Packing Technician, ProductionJBFM Flour Mill Sdn BhdMYR2,000 - MYR2,000 SebulanLihat GajiSepenuh MasaPraiHari iniSimpanMohon
Packaging Engineering ManagerPower IntegrationsUndisclosedLihat GajiSepenuh MasaMalaysia4 hariSimpanMohon
Packing Technician, ProductionJBFM Flour Mill Sdn BhdMYR2,200 - MYR3,200 SebulanLihat GajiSepenuh MasaPrai10 hariSimpanMohon
FRESH GRAD - Associate Packaging Engineer, Material EngineeringSandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat25 hariSimpanMohon
Engineer, Packaging Engineering (Mechanical Design)SandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat21 hariSimpanMohon
Packing Technician, ProductionJBFM Flour Mill Sdn BhdMYR2,200 - MYR3,200 SebulanLihat GajiSepenuh MasaPrai24 hariSimpanMohon
Staff Engineer, Packaging Engineering, Structural SimulationSandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat22 hariSimpanMohon
Master Lead Engineering Support Technician, Packaging EngineeringSandiskUndisclosedLihat GajiSepenuh MasaSimpang Ampat16 hariSimpanMohon
Senior Engineer, Packaging Engineering (FIB)SandiskUndisclosedLihat GajiSepenuh MasaMalaysia30+ hariSimpanMohon
Staff Engineer - Packaging Automation (Process Development)B. Braun GroupUndisclosedLihat GajiSepenuh MasaBayan Lepas30+ hariSimpanMohon
Staff Engineer - Packaging Automation (Process Development)B. Braun GroupUndisclosedLihat GajiSepenuh MasaBayan Lepas30+ hariSimpanMohon
Process Development Senior Engineer (Die Attach - Wire Bond)OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., PenangUndisclosedLihat GajiSepenuh MasaBayan Lepas10 hariSimpanMohon