200+ Jawatan Kosong Packaging Engineer di Malaysia | Kerja Kosong | November 2026

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Paparan 265 hasil carian kerja kosong untuk "packaging engineer"

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Associate Engineer (Packaging Lab)TÜV SÜDSepenuh MasaSingapore

MTS - Advanced Packaging 2.5D and Deep Trench Integration EngineerGLOBALFOUNDRIES SINGAPORE PTE. LTD.Sepenuh MasaSingapore

Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology EngineeringMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Sepenuh MasaSingapore

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology EngineeringMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Sepenuh MasaSingapore

Lead Advanced Packaging Design EngineerPride GlobalSepenuh MasaGeorge Town

Senior Packaging Development Engineer - Substrate ModulesTexas InstrumentsSepenuh MasaMalaysia

Senior Packaging Development Engineer - Substrate ModulesTexas InstrumentsSepenuh MasaMalacca City

Senior Packaging Development Engineer - Leadframe Package-CeramicTexas InstrumentsSepenuh MasaMalaysia

Senior Packaging Development Engineer - Leadframe Package-CeramicTexas InstrumentsSepenuh MasaMalacca City

Advanced Packaging Principle Integration Technologist (Principal Engineer, 10 years- experience) 1Merck ElectronicsSepenuh MasaSingapore

Staff Equipment Engineer (Advanced Packaging)LumilensSepenuh MasaSingapore

[0580] Application - Process Engineer – Semiconductor Die Bonding -- Advanced Packaging | Up to $6k - 5 days - WoodlandsTHE SUPREME HR ADVISORY PTE. LTD.Sepenuh MasaSingapore

[0580] Process Engineer – Semiconductor Die Bonding -- Application -- Advanced Packaging | Up to $6k - 5 days - WoodlandsTHE SUPREME HR ADVISORY PTE. LTD.Sepenuh MasaSingapore

Staff Engineer - Packaging Automation (Process Development)B. Braun GroupSepenuh Masa Bayan Lepas

ENGINEER SR, PACKAGE DEVELOPMENTOnsemiSepenuh Masa Seremban

ENGR STAFF, R-D ENGINEERING PKG-ASSYOnsemiSepenuh Masa Seremban

Sr. Package EngineerSiTimeSepenuh MasaSingapore

Principal Engineer - MTS, PDE Package DesignMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Sepenuh MasaSingapore

Senior Research Engineer II, IVR, VPD, Adv Pkg, IMEA*STAR - Agency For Science, Technology And ResearchSepenuh MasaSingapore

Staff-Principal, APTD CEM - Advanced Packaging Wafer Level Technology EngineeringMICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.Sepenuh MasaSingapore

ENGR STAFF, PROCESS PKG-ASSYOnsemiSepenuh Masa Seremban

SUPERVISOR (PACKAGING)Sajian Ambang Sdn BhdSepenuh Masa Shah Alam

Senior Associate Process Engineer - Package pick - place processSTATS ChipPAC Pte. Ltd.Sepenuh MasaYishun

Packaging Technology Integration, Senior Staff EngineerQualcommSepenuh MasaSingapore

Staff - Senior Staff Engineer Package Technology DevelopmentInfineon TechnologiesSepenuh MasaSingapore

Senior Associate Process Engineer - Package pick - place processSTATS CHIPPAC PTE. LTD.Sepenuh MasaSingapore

ENGINEER SR, PACKAGE DEVELOPMENTOnsemiSepenuh Masa Seremban

CSA Package Lead (Semiconductor - Industrial - Science) - JohorTurner & Townsend Pty LimitedSepenuh Masa Johor Bahru

CSA Package Lead (Semiconductor - Industrial - Science) - JohorTurner & TownsendSepenuh Masa Johor Bahru

Cari Lokasi:

pulau pinang (35)

west region (singapore) (24)

north region (singapore) (23)

selangor (19)

islandwide (singapore) (17)

Papar Lebih Lokasi

Cari Syarikat:

ASE Electronics (M) Sdn. Bhd. (9)

STMicroelectronics (6)

Turner & Townsend (6)

NXP Semiconductors (5)

MCI CAREER SERVICES PTE LTD (4)

Papar Lebih Syarikat

Cari Kerja "packaging engineer" Berdasarkan:

Cari Kerja "packaging engineer" Berdasarkan:

Other Industries (256)

Kejuruteraan / Penyelengaraan (7)

Makanan & Minuman (1)

Pembuatan / Alam Sekitar / Perlombongan (1)

200+ Jawatan Kosong Packaging Engineer di Malaysia | Kerja Kosong | November 2026 | Maukerja - Halaman 3

Urus Pemberitahuan

Associate Engineer (Packaging Lab)

MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer

Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Lead Advanced Packaging Design Engineer

Senior Packaging Development Engineer - Substrate Modules

Senior Packaging Development Engineer - Substrate Modules

Senior Packaging Development Engineer - Leadframe Package-Ceramic

Senior Packaging Development Engineer - Leadframe Package-Ceramic

Advanced Packaging Principle Integration Technologist (Principal Engineer, 10 years- experience) 1

Staff Equipment Engineer (Advanced Packaging)

[0580] Application - Process Engineer – Semiconductor Die Bonding -- Advanced Packaging | Up to $6k - 5 days - Woodlands

[0580] Process Engineer – Semiconductor Die Bonding -- Application -- Advanced Packaging | Up to $6k - 5 days - Woodlands

Staff Engineer - Packaging Automation (Process Development)

ENGINEER SR, PACKAGE DEVELOPMENT

ENGINEER SR, PACKAGE DEVELOPMENT

ENGR STAFF, R-D ENGINEERING PKG-ASSY

Sr. Package Engineer

Principal Engineer - MTS, PDE Package Design

Senior Research Engineer II, IVR, VPD, Adv Pkg, IME

Staff-Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

ENGR STAFF, PROCESS PKG-ASSY

SUPERVISOR (PACKAGING)

Senior Associate Process Engineer - Package pick - place process

Packaging Technology Integration, Senior Staff Engineer

Staff - Senior Staff Engineer Package Technology Development

Senior Associate Process Engineer - Package pick - place process

ENGINEER SR, PACKAGE DEVELOPMENT

CSA Package Lead (Semiconductor - Industrial - Science) - Johor

CSA Package Lead (Semiconductor - Industrial - Science) - Johor