Packaging and filling machine operators tend machines for preparing and packing food products in various packaging containers such as jars, cartons, cans, and others.
The Semiconductor Packaging Engineer / Architect is a research and development engineer responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies.
Investigates the feasibility of applying scientific and engineering principles and emerging technologies and capabilities to potential semiconductor packaging and assembly process offerings. Then, effectively develops or designs the implementation of these into manufacturing.
Maintains substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences.
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At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
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At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.
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